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Hydrogen Fluoride

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Hydrogen Fluoride

Formula: HF

CAS No: 7664-39-3

Hydrogen Fluoride (HF) is a colorless, poisonous, and highly corrosive liquefied gas. In its anhydrous form, HF is an essential industrial reagent with powerful fluorinating capabilities, making it critical in the production of a wide range of fluorinated compounds.

In semiconductor manufacturing, HF is a key etchant for silicon oxide layers, enabling precise patterning and surface preparation in microelectronics fabrication. Its ability to selectively remove oxides without significantly attacking underlying silicon makes it indispensable for advanced device processing.

Applications include:

  • Fluorinating agent in the manufacture of fluorinated compounds.

  • Catalyst in isomerization, condensation, dehydration, polymerization, and hydrolysis reactions.

  • Starting material for the electrolytic production of fluorine gas.

  • Etchant for silicon oxide in semiconductor device manufacturing.

  • Glass etching for producing frosted or patterned surfaces.

Material Compatibility:

Hydrogen fluoride is highly corrosive and will attack glass, ceramics, and most metals, particularly in the presence of moisture, forming hydrofluoric acid. Carbon steel, stainless steel, and copper alloys are not recommended. Storage and handling equipment should be constructed from compatible materials such as Monel®, PTFE, polyethylene, or other fluoropolymers.

EFC Gases & Advanced Materials supplies high-purity hydrogen fluoride, with rigorous analytical verification to ensure consistent quality for the most demanding semiconductor, electronics, and chemical applications. Controlled packaging, handling, and logistics protect product integrity from production to point-of-use.

Applications
Specifications
Further Specifications
Cylinder Sizes
  • Fluorinate compounds in chemical synthesis.
  • Catalyze isomerization, condensation, and polymerization reactions.
  • Produce elemental fluorine by electrolysis.
  • Etch glass for frosted or patterned surfaces.
  • Etch silicon oxide in semiconductor manufacturing.
Grade 4.5
Purity 99.995%
Sulfuric Acid < 25 ppmv
Sulfur Dioxide < 15 ppmv
Hexalfuorosilicilic Acid < 15 ppmv
Chemical & Physical Properties
Molecular Weight 20.01
Specific Volume 19.3 cu.ft/lb
Pressure @ 70° F 0.7 psig
Valve Outlet CGA 660 DISS 638
Shipping Information
DOT Name Hydrogen Fluoride, anhydrous
Hazard Class 8 Poison Gas Hazard Zone C
DOT No. UN 1052
DOT Label Poison Gas Inhalation Hazard Poison Corrosive
CAS No. 7664-39-3
Cylinder Size Fill Weight (lb)
44L/Size 200 50
16L/Size 80 25
7L/Size 35 4

Moisture level guaranteed only when EFC Gases & Advanced Materials prepares the cylinders.
All concentrations are on a mol/mol basis unless otherwise stated.