Difluoromethane
Difluoromethane
Formula: CH2F2, R-32, HFC-32
CAS No: 75-10-5
Difluoromethane (CH2F2) is a colorless, flammable gas widely used as a primary refrigerant, as a component in refrigerant blends, and as a reactive ion etching gas in semiconductor manufacturing. As a refrigerant, HFC-32 combines low flammability with a relatively low Global Warming Potential (GWP = 677, per IPCC AR5), making it an efficient and more environmentally responsible alternative to higher-GWP gases.
In semiconductor processing, HFC-32’s 2:1 fluorine-to-carbon ratio provides a unique source of fluorocarbene radicals with hydrogen atoms during reactive ion etching. Optimized etching processes using HFC-32 can produce recessed features with vertical profiles, minimal bowing or twisting, and high circularity—while maintaining high selectivity and strong etch rates. These etching recipes are applicable to a range of materials, including silicon oxide, silicon nitride, silicon carbide, and other advanced semiconductor layers.
Applications include:
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Primary refrigerant in residential, commercial, and industrial cooling systems.
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Component in blended refrigerants for air conditioning and refrigeration.
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Reactive ion etching gas in semiconductor manufacturing.
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Etching of recessed features in silicon oxide, silicon nitride, silicon carbide, and other semiconductor layers.
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Processing of features with vertical profiles, minimal bowing or twisting, and high circularity in advanced device fabrication.
EFC Gases & Advanced Materials supplies high-purity difluoromethane to meet the performance, safety, and compliance requirements of both refrigeration and semiconductor customers. Our rigorous analytical verification, specialized packaging, and controlled logistics ensure product integrity from production through delivery.
Applications
Specifications
Further Specifications
Cylinder Sizes
- Cool residential, commercial, and industrial systems.
- Blend into refrigerant mixtures.
- Etch semiconductor materials.
- Process recessed features in advanced devices.
- Fabricate silicon oxide, nitride, and carbide layers.
| Grade 3 | Grade 4 | |
|---|---|---|
| Purity | 99.9% | 99.99% |
| Nitrogen | < 300 ppmv | < 40 ppmv |
| Oxygen | < 50 ppmv | <10 ppmv |
| Carbon Diozide | < 5 ppmv | |
| Moisture | < 100 ppmv | < 5 ppmv |
| Other Halocarbons | < 60 ppmv | |
| Acidity | < 0.1 pp/w | |
| Other Organics | < 700 ppmv |
| Chemical & Physical Properties | |
|---|---|
| Molecular Weight | 52.02 |
| Specific Volume | 7.19 cu.ft/lb |
| Pressure @ 70° F | 23.5 psig |
| Valve Outlet: CGA 350 | CGA 350 DISS 724 |
| Shipping Data | |
|---|---|
| DOT Name | Difluoromethane |
| Hazard Class | 2.1 |
| DOT No. | UN 3252 |
| DOT Label | Red, Flammable Gas |
| Cas No. | 75-10-5 |
| Cylinder Size | Fill Weight (lb) |
|---|---|
| 44L/Size 200 | 65 |
| 16L/Size 80 | 25 |
| 7L/Size 35 | 15 |
Moisture level guaranteed only when EFC Gases & Advanced Materials prepares the cylinders.
All concentrations are on a mol/mol basis unless otherwise stated. Product sold on the basis of total impurities. Individual impurities may vary slightly.
